Title
Three-dimensional nanometric sub-surface imaging of a silicon flip-chip using the two-photon optical beam induced current method
Abstract
Two- and three-dimensional sub-surface optical beam induced current imaging of a silicon flip-chip is described and is illustrated by results corresponding to 166nm lateral resolution and an axial performance capable of localising feature depths to around 100nm accuracy. The experimental results are compared with theoretically modelled performance based on analytic expressions for the system point spread functions valid for high numerical apertures, and are interpreted using numerical geometric ray tracing calculations. Examples of depth-resolved feature profiling are presented and include depth cross-sections through a matrix of tungsten vias and a depth-resolved image of part of a poly-silicon wire.
Year
DOI
Venue
2007
10.1016/j.microrel.2007.07.069
Microelectronics Reliability
Keywords
Field
DocType
ray tracing,flip chip,three dimensional,numerical aperture,point spread function,cross section
Aperture,Flip chip,Ray tracing (graphics),Matrix (mathematics),Numerical aperture,Tungsten,Optics,Engineering,Optical beam-induced current,Silicon
Journal
Volume
Issue
ISSN
47
9
0026-2714
Citations 
PageRank 
References 
1
0.48
0
Authors
7
Name
Order
Citations
PageRank
E. Ramsay121.30
K. A. Serrels210.48
M. J. Thomson310.48
A. J. Waddle410.48
R. J. Warburton510.82
M. R. Taghizadeh610.48
D. T. Reid710.48