Name
Abstract | ||
|---|---|---|
Three-dimensional (3D) integration has become one of the most promising techniques for the development of future multi-core processors, since it improves performance and reduces power consumption by decreasing global wire length. However, 3D integration causes serious thermal problems because the closer proximity of heat generating dies makes existing thermal hotspots more severe. Thermal-aware fl... |
Year | DOI | Venue |
|---|---|---|
2012 | 10.1049/iet-cds.2011.0350 | IET Circuits, Devices & Systems |
Keywords | Field | DocType |
microprocessor chips,system-on-chip,thermal management (packaging),three-dimensional integrated circuits | Multi processor,Profiling (computer programming),Electronic engineering,Dynamic demand,Three dimensional integration,Mathematics,Power consumption,Embedded system | Journal |
Volume | Issue | ISSN |
6 | 5 | 1751-858X |
Citations | PageRank | References |
0 | 0.34 | 17 |
Authors | ||
4 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Ignacio Arnaldo | 1 | 81 | 7.69 |
| José Luis Risco-Martín | 2 | 54 | 7.71 |
| José Luis Ayala | 3 | 6 | 3.55 |
| Jose Ignacio Hidalgo | 4 | 135 | 22.61 |