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Transient Thermal Characteristics of VLSI Devices : Evaluation and Application
Paper Info
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Title
Transient Thermal Characteristics of VLSI Devices : Evaluation and Application
Year
Venue
Field
1986
ITC
Thermal,Computer science,Electronic engineering,Very-large-scale integration
DocType
Citations
PageRank
Conference
0
0.34
References
Authors
0
2
Authors (2 rows)
Cited by (0 rows)
References (0 rows)
Name
Order
Citations
PageRank
M. Aghazadeh
1
0
0.34
M. Kirschner
2
0
0.34
1