Name
Abstract | ||
|---|---|---|
This paper reports on the development of a hybrid approach to electro-thermal modeling of power device assemblies, suitable for reliability-oriented thermal design of power modules and converters. The temperature-dependent electrical model of a power MOSFET is self-consistently coupled with a dynamic lumped-element thermal network representing the die - package - heat-sink assembly and convective boundary conditions. The lumped-element network elements are calculated on the basis of geometrical dimensions and materials physical characteristics. The results of the lumped-element model are compared with thermal measurements in both steady-state and transient conditions. The model is compared with measurement result over an extended time scale, ranging from microseconds to tens of minutes. (C) 2011 Elsevier Ltd. All rights reserved. |
Year | DOI | Venue |
|---|---|---|
2011 | 10.1016/j.microrel.2011.06.016 | MICROELECTRONICS RELIABILITY |
Keywords | Field | DocType |
electro-thermal modeling,power devices,heat sink,steady state,boundary condition | Boundary value problem,Convection,Thermal,Power MOSFET,Mechanical engineering,Power module,Electronic engineering,Converters,Ranging,Network element,Engineering | Journal |
Volume | Issue | ISSN |
51 | SP9-11 | 0026-2714 |
Citations | PageRank | References |
1 | 0.42 | 4 |
Authors | ||
4 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| P. Cova | 1 | 73 | 26.17 |
| M. Bernardoni | 2 | 17 | 5.69 |
| N. Delmonte | 3 | 29 | 9.69 |
| Roberto Menozzi | 4 | 25 | 8.90 |