Name
Abstract | ||
|---|---|---|
The paper presents a methodology for simulating the static and dynamic performance of integrated circuits in the presence of electro-thermal interactions on the integrated circuit die. The technique is based on the coupling of a finite element method (FEM) program with a circuit simulator. In contrast to other known simulator couplings a time step algorithm is used, Its implementation in simulation tools is described. The thermal modeling of the die/package structure and the extended modeling of the electronic circuit is discussed. Simulation results which indicate the capabilities of the methodology for electro-thermal simulation are compared to experimental results. |
Year | DOI | Venue |
|---|---|---|
1997 | 10.1109/92.609870 | IEEE Trans. VLSI Syst. |
Keywords | Field | DocType |
electronic circuit,circuit simulator,simulation tool,thermal modeling,simulator coupling,analog modeling with behavioral languages,cir- cuit simulation,simulation result,known simulator,thermal modeling. i. introduction,integrated circuit,electro-thermal circuit simulation,index terms,extended modeling,finite element simulation,electro-thermal simulation,electro-thermal interaction,vlsi,finite element method,relaxation methods,indexing terms,thermal conductivity,temperature,finite element analysis,integrated circuit packaging,finite element methods | Simulation,Computer science,Integrated circuit packaging,Circuit design,Finite element method,Electronic engineering,Physical design,Electronic circuit simulation,Electronic circuit,Very-large-scale integration,Integrated circuit | Journal |
Volume | Issue | ISSN |
5 | 3 | 1063-8210 |
Citations | PageRank | References |
20 | 3.58 | 3 |
Authors | ||
4 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Stefan Wüsche | 1 | 20 | 3.58 |
| Christoph Clauß | 2 | 23 | 5.73 |
| Peter Schwarz | 3 | 20 | 3.58 |
| Frank Winkler | 4 | 36 | 9.50 |