Name
Title | ||
|---|---|---|
Fabrication Of Chip Scale Piezoresistive Pressure Sensors Using Screen-Printed Glass Frit Packaging |
Year | DOI | Venue |
|---|---|---|
2003 | 10.1142/S146587630300123X | International Journal of Computational Engineering Science |
Keywords | Field | DocType |
pressure sensor,pressure sensors | Wafer,Composite material,Glass frit bonding,Pressure sensor,Residual stress,Frit,Chip-scale package,Materials science,Piezoresistive effect,Chemical-mechanical planarization | Journal |
Volume | Issue | Citations |
4 | 2 | 0 |
PageRank | References | Authors |
0.34 | 0 | 3 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Ciprian Iliescu | 1 | 3 | 3.39 |
| Jianmin Miao | 2 | 7 | 8.41 |
| Marioara Avram | 3 | 0 | 0.68 |