Name
Abstract | ||
|---|---|---|
Electromigration is a major source of wire and via failure. Refueling undoes EM for bidirectional wires and power/ground grids—some of a chip's most vulnerable wires. Refueling exploits EM's self-healing effect by balancing the amount of current flowing in both directions of a wire. It can significantly extend a wire's lifetime while reducing the chip area devoted to wires. |
Year | DOI | Venue |
|---|---|---|
2008 | 10.1109/MM.2008.92 | IEEE Micro |
Keywords | Field | DocType |
chip area,bidirectional wire,ground grid,vulnerable wire,preventing wire degradation,major source,self-healing effect,refueling undoes em,current density,fault tolerance,chip,failure analysis,radiation detectors,electromigration,metals,reliability,transistors,testing | Particle detector,Current density,Computer science,Parallel computing,Design styles,Chip,Degradation (geology),Fault tolerance,Electromigration,Transistor,Electrical engineering | Journal |
Volume | Issue | ISSN |
28 | 6 | 0272-1732 |
Citations | PageRank | References |
9 | 0.78 | 3 |
Authors | ||
6 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Jaume Abella | 1 | 1046 | 76.34 |
| Xavier Vera | 2 | 552 | 30.31 |
| Osman S. Unsal | 3 | 575 | 55.65 |
| Oguz Ergin | 4 | 424 | 25.84 |
| Antonio González | 5 | 3178 | 229.66 |
| James Tschanz | 6 | 963 | 121.38 |