Paper Info
Title
Failure Analysis of RuO2 Thick Film Chip Resistors.
Abstract
This work presents the results of Failure Analysis carried out on RuO2 Thick Film Chip Resistors in field failed. Microscopical investigation performed on virgin, degraded and open circuit devices showed the failure mechanism involved: evidence for mechanical cracks may be related with the observed degradation and failures. On the failed and degraded devices some bad adhesion of the resistive film on the metallized alumina has been observed, which also could be consistent with thermomechanical hypothesis for the failure mechanism. (C) 2004 Elsevier Ltd. All rights reserved.
Year
DOI
Venue
2004
10.1016/j.microrel.2004.07.103
MICROELECTRONICS RELIABILITY
DocType
Volume
Issue
Journal
44
9-11
ISSN
Citations 
PageRank 
0026-2714
0
0.34
References 
Authors
0
4
Name
Order
Citations
PageRank
S. Podda11910.88
G. Cassanelli2213.85
F. Fantini33310.12
Massimo Vanzi43512.63