Name
Abstract | ||
|---|---|---|
In harsh environments, materials are used at their strength limits, and it might be difficult to accelerate the ageing in reliability tests without modifying the failure mechanisms. The paper presents a methodology used to define the maximal acceleration temperature for ageing of wire-bonds aimed to be used at an operational temperature up to 200 degrees C. Reliable wire bond interconnects are essential despite of intermetallic growth accelerated as the temperature increases. Wire bonds shown reliable long term performance at 250 degrees C and the possibility of accelerating the ageing up 300 degrees C was demonstrated. Beyond this temperature a new ageing mechanism was identified. (C) 2012 Elsevier Ltd. All rights reserved. |
Year | DOI | Venue |
|---|---|---|
2012 | 10.1016/j.microrel.2012.06.104 | MICROELECTRONICS RELIABILITY |
Field | DocType | Volume |
Bond,Nanotechnology,Wire bonding,Intermetallic growth,Mechanical engineering,Acceleration,Engineering,Reliability engineering | Journal | 52 |
Issue | ISSN | Citations |
SP9-10 | 0026-2714 | 0 |
PageRank | References | Authors |
0.34 | 1 | 3 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| J. B. Jullien | 1 | 2 | 0.81 |
| B. Plano | 2 | 12 | 3.24 |
| Hélène Frémont | 3 | 20 | 12.71 |