Name
Abstract | ||
|---|---|---|
The fast development of device fabrication technology stimulates new challenging technology development and progress in wafer processing, module interconnections and packaging technology. Apart from a broad hardware experience, standalone software design simulations before a hardware fabrication are a necessity. This paper discusses software issues of the design and an experimental attempt to the device description and the device description data transfer. |
Year | DOI | Venue |
|---|---|---|
2008 | 10.1016/j.microrel.2008.06.023 | Microelectronics Reliability |
Keywords | Field | DocType |
data transfer,software design | Software design,Data transmission,Electronic packaging,Electronic engineering,Software,Engineering,Packaging engineering,Interconnection,Integrated circuit,System integration,Embedded system | Journal |
Volume | Issue | ISSN |
48 | 8 | 0026-2714 |
Citations | PageRank | References |
0 | 0.34 | 0 |
Authors | ||
4 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Grzegorz Janczyk | 1 | 0 | 1.69 |
| Tomasz Bieniek | 2 | 0 | 2.03 |
| Jerzy Szynka | 3 | 0 | 0.68 |
| Piotr Grabiec | 4 | 2 | 2.61 |