Title
Dynamic thermal management in mobile devices considering the thermal coupling between battery and application processor
Abstract
The thermal management is a crucial design problem for mobile devices because it greatly affects not only the device reliability, but also the leakage energy consumption. Conventional dynamic thermal management (DTM) techniques work well for the computer systems. However, due to the limitation of the physical space in mobile devices, the thermal coupling effect between the major heat generation components, such as the application processor (AP) and the battery, plays an important role in determining the temperature inside the mobile device package. Due to this effect, the thermal behavior of one part is no longer independent of the other, but is affected by the temperature of other parts. This is the first work that quantitatively characterizes the thermal coupling between the battery and AP and presents a predictive DTM for mobile devices considering this effect. Simulation results show that the proposed DTM method significantly reduces the thermal violations for the target mobile devices.
Year
DOI
Venue
2013
10.1109/ICCAD.2013.6691125
ICCAD
Keywords
Field
DocType
thermal behavior,mobile device,thermal violation reduction,thermal coupling,telecommunication network reliability,smartphones,thermal violation,thermal management (packaging),dtm method,thermal coupling effect,computer systems,application processor,heat generation components,temperature determination,dynamic thermal management,conventional dynamic thermal management,mobile device package,battery,target mobile device,predictive dtm,thermal management,mobile computing,design problem,leakage energy consumption,telecommunication power supplies
Mobile computing,Thermal,Computer science,Thermal management of electronic devices and systems,Electronic engineering,Application processor,Mobile device,Thermal coupling,Physical space,Battery (electricity)
Conference
ISSN
ISBN
Citations 
1092-3152
978-1-4799-1069-4
19
PageRank 
References 
Authors
1.19
13
6
Name
Order
Citations
PageRank
Qing Xie128720.06
Jaemin Kim2346.84
Yanzhi Wang31082136.11
Donghwa Shin439632.34
Naehyuck Chang51985185.85
Massoud Pedram678011211.32