Name
Abstract | ||
|---|---|---|
Highly scaled technologies at and beyond the 22-nm node exhibit increased sensitivity to various scaling-related problems that conspire to reduce the overall reliability of integrated circuits and systems. In prior technology nodes, the assumption was that manufacturing technology was responsible for ensuring device reliability. This basic assumption is no longer tenable. Trying to contain reliability problems purely at the technology level would cause prohibitive increases in power consumption. Thus, a cross-layer approach is required, which spreads the burden of ensuring resilience across multiple levels of the design hierarchy. This article illustrates a methodology for dealing with scaling-related problems via two case studies that link models of low-level technology-related problems to system behavior. |
Year | DOI | Venue |
|---|---|---|
2013 | 10.1109/MM.2013.67 | IEEE Micro |
Keywords | Field | DocType |
prior technology node,impact system resilience,device reliability,technology level,cross-layer technology-based study,scaling-related problem,various scaling-related problem,basic assumption,manufacturing technology,22-nm node exhibit,reliability problem,overall reliability,integrated circuit design,computer architecture,semiconductor devices,data models,resilience | Cross layer,Psychological resilience,Data modeling,Manufacturing technology,Computer science,Parallel computing,Real-time computing,Integrated circuit design,Hierarchy,Integrated circuit,Memory errors | Journal |
Volume | Issue | ISSN |
33 | 4 | 0272-1732 |
Citations | PageRank | References |
12 | 0.55 | 8 |
Authors | ||
8 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Veit Kleeberger | 1 | 57 | 3.83 |
| Christina Gimmler-Dumont | 2 | 57 | 4.92 |
| Christian Weis | 3 | 284 | 26.11 |
| Andreas Herkersdorf | 4 | 703 | 88.32 |
| Daniel Mueller-Gritschneder | 5 | 123 | 14.40 |
| Sani R. Nassif | 6 | 2268 | 247.45 |
| Ulf Schlichtmann | 7 | 645 | 70.67 |
| Norbert Wehn | 8 | 1165 | 137.17 |