Paper Info
Title
3D thermal-ADI: an efficient chip-level transient thermal simulator
Abstract
Recent studies show that the nonuniform thermal distribution on the substrate and interconnects has impact on the circuit reliability and performance. Hence three-dimensional (3-D) thermal analysis is crucial to analyze these effects. In this paper, we present and develop an efficient 3-D transient thermal simulator based on the alternating direction implicit (ADI) method for large scale temperature estimation problems. Our simulator, 3D Thermal-ADI, not only has a linear runtime and memory requirement, but also is unconditionally stable. Detailed analysis of the 3-D nonhomogeneous cases and boundary conditions for on-chip VLSI applications are introduced and presented. Extensive experimental results show that our algorithm is not only orders of magnitude faster than the traditional thermal simulation algorithms, but is also highly accurate and memory efficient. The temperature profile of steady state can be reached in few iterations. The software is avaiable on the web [1].
Year
DOI
Venue
2003
10.1145/640000.640007
ISPD
Keywords
Field
DocType
detailed analysis,3-d nonhomogeneous case,thermal analysis,chip-level transient thermal simulator,boundary condition,traditional thermal simulation algorithm,large scale temperature estimation,3-d transient thermal simulator,memory requirement,temperature profile,nonuniform thermal distribution,finite difference method,finite difference methods,alternating direction implicit,adi,steady state,design,automation,temperature,three dimensional,chip
Alternating direction implicit method,Boundary value problem,Mathematical optimization,Computer science,Simulation,Circuit reliability,Chip,Finite difference method,Steady state,Thermal analysis,Very-large-scale integration
Conference
ISBN
Citations 
PageRank 
1-58113-650-1
22
1.99
References 
Authors
9
3
Name
Order
Citations
PageRank
Ting-Yuan Wang124020.37
Yu-Min Lee21016.93
Charlie Chung-Ping Chen31396137.82