Name
Abstract | ||
|---|---|---|
This paper develops an assessment methodology based on vibration tests and finite element analysis (FEA) to predict the fatigue life of electronic components under random vibration loading. A specially designed PCB with ball grid array (BGA) packages attached was mounted to the electro-dynamic shaker and was subjected to different vibration excitations at the supports. An event detector monitored the resistance of the daisy chained circuits and recorded the failure time of the electronic components. In addition accelerometers and dynamic signal analyzer were utilized to record the time-history data of both the shaker input and the PCB’s response. |
Year | DOI | Venue |
|---|---|---|
2011 | 10.1016/j.microrel.2010.10.003 | Microelectronics Reliability |
Keywords | Field | DocType |
spectrum analysis,ball grid array,finite element,random vibration,power spectral density,natural frequency,cumulant,harmonic analysis,fourier transform | Natural frequency,Ball grid array,Vibration fatigue,Cycle count,Finite element method,Electronic engineering,Vibration,Engineering,von Mises yield criterion,Random vibration | Journal |
Volume | Issue | ISSN |
51 | 3 | 0026-2714 |
Citations | PageRank | References |
13 | 1.41 | 2 |
Authors | ||
5 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Da Yu | 1 | 18 | 2.63 |
| Abdullah Al-Yafawi | 2 | 13 | 1.41 |
| Tung T Nguyen | 3 | 57 | 8.29 |
| Seung-Bae Park | 4 | 64 | 8.99 |
| Soon-Wan Chung | 5 | 13 | 1.75 |