Name
Abstract | ||
|---|---|---|
Microbumps consisting of intermetallic compounds like Cu6Sn5 or Cu3Sn have a longer lifetime during electromigration tests than SnAgCu microbumps. To explain the difference in behavior of Cu-Sn IMCs and SnAgCu during stress test the migration induced mass flux was calculated for Cu3Sn and Cu6Sn5. The results were compared to the mass flux in SnAgCu 305. Furthermore average effective charge values for Cu3Sn and Cu6Sn5 were approximated by comparing the separated movement of Cu and Sn with three different models for an averaged mass flux in the IMCs. (C) 2011 Elsevier Ltd. All rights reserved. |
Year | DOI | Venue |
|---|---|---|
2011 | 10.1016/j.microrel.2011.06.032 | Microelectronics Reliability |
Keywords | DocType | Volume |
electromigration,stress testing,intermetallic compound | Journal | 51 |
Issue | ISSN | Citations |
9 | 0026-2714 | 4 |
PageRank | References | Authors |
0.72 | 3 | 3 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Lutz Meinshausen | 1 | 8 | 3.47 |
| Kirsten Weide-Zaage | 2 | 31 | 14.97 |
| Hélène Frémont | 3 | 20 | 12.71 |