Paper Info
Title
A general dispersive multiconductor transmission line model for interconnect simulation in SPICE
Abstract
Although numerous methods have been proposed for interconnect simulation, no single model exists for all kind of transmission line problems. This paper presents a new, single, general dispersive coupled uniform/nonuniform transmission line model which can be used for interconnect simulation in SPICE. The mathematical model is based on the use of Chebyshev polynomials for the representation of the spatial variation of the transmission-line voltages and currents. A simple collocation procedure is used to obtain a matrix representation of the transmission line equations with matrix coefficients that are first polynomials in s, and in which terminal transmission-line voltages and currents appear explicitly. Thus, the model is compatible with both the SPICE's numerical integration algorithm and the modified nodal analysis formalism.
Year
DOI
Venue
1996
10.1145/244522.244911
ICCAD
Keywords
Field
DocType
terminal transmission-line voltage,single model,transmission line equation,mathematical model,transmission line problem,matrix representation,multiconductor transmission lines,transient analysis,transmission-line voltage,general dispersive multiconductor transmission,chebyshev polynomial,nonuniform transmission line model,matrix coefficient,chebyshev approximation,interconnect simulation,numerical integration,transmission lines,numerical method,polynomials,spatial variation,transmission line,transmission line model,modified nodal analysis
Chebyshev polynomials,Transmission line,Spice,Computer science,Matrix (mathematics),Numerical integration,Approximation theory,Electronic engineering,Modified nodal analysis,Matrix representation
Conference
ISSN
ISBN
Citations 
1063-6757
0-8186-7597-7
2
PageRank 
References 
Authors
0.49
3
2
Name
Order
Citations
PageRank
Mustafa Celik170262.15
Andreas C. Cangellaris2112.85