Paper Info
Title
3D-SoftChip: a novel 3D vertically integrated adaptive computing system (abstract only)
Abstract
This paper introduces a novel 3-Dimensional (3D) vertically integrated adaptive computing system. This 3D-SoftChip is a combination of state-of-the-art processing and interconnection technology. It comprises the vertical integration of two chips (a Configurable Array Processor and an Intelligent Configurable Switch) through indium bump 3D interconnections. The Configurable Array Processor (CAP) is an array of heterogeneous processing elements (PEs) while the Intelligent Configurable Switch (ICS) comprises a switch block, 32-bit dedicated RISC processor for control, on-chip program/data memory, data frame buffer along with a Direct Memory Access (DMA) controller. This paper introduces the 3D-Softchip architecture for real-time communication and multimedia signal processing as a next generation computing system and describes the HW/SW codesign and verification methodology using SystemC.
Year
DOI
Venue
2005
10.1145/1046192.1046244
FPGA
Keywords
DocType
ISBN
configurable array processor,data frame buffer,intelligent configurable switch,direct memory access,heterogeneous processing element,adaptive computing system,state-of-the-art processing,next generation computing system,32-bit dedicated risc processor,data memory,speculation,chip,signal processing,networking,reconfigurable hardware,3 dimensional,vertical integration
Conference
1-59593-029-9
Citations 
PageRank 
References 
0
0.34
0
Authors
3
Name
Order
Citations
PageRank
Chul Kim1194.74
Alex Rassau200.68
Mike Myung-Ok Lee344.04