Title
Current path analysis for electrostatic discharge protection
Abstract
The electrostatic discharge (ESD) problem has become a challenging reliability issue in nanometer circuit design. High voltages resulted from ESD might cause high current densities in a small device and burn it out, so on-chip protection circuits for IC pads are required. To reduce the design cost, the protection circuit should be added only for the IC pads with an ESD current path, which arises the ESD current path analysis problem. In this paper, we first introduce the analysis problem for ESD protection in circuit design. We then model the circuit as a constrained graph, decompose ESD connected components linked with the pads, and apply the breadth-first search (BFS) to identify the ESD connected components in each constrained graph and thus the current paths. Experimental results show that our algorithm can detect all ESD paths very efficiently and economically. To our best knowledge, our algorithm is the first point tool available to the public for the ESD analysis.
Year
DOI
Venue
2006
10.1145/1233501.1233604
ICCAD
Keywords
Field
DocType
esd protection,esd connected component,decompose esd connected component,circuit design,esd current path,current path,esd current path analysis,esd analysis,esd path,electrostatic discharge protection,ic pad,path analysis,integrated circuit design,nanoelectronics,graph theory,high voltage,network analysis,connected component,current density,breadth first search,performance,vlsi,electrostatic discharge,manufacturability,chip
Electrostatic discharge,Computer science,Voltage,Circuit design,Electronic engineering,Integrated circuit design,Connected component,Network analysis,Electronic circuit,Very-large-scale integration,Electrical engineering
Conference
ISBN
Citations 
PageRank 
1-59593-389-1
0
0.34
References 
Authors
1
7
Name
Order
Citations
PageRank
Hung-Yi Liu119410.47
Chung-Wei Lin219520.34
Szu-Jui Chou3413.02
Wei-Ting Tu421.38
Chih-Hung Liu5504.82
Yao-Wen Chang63437253.54
Sy-Yen Kuo72304245.46