Name
Title | ||
|---|---|---|
A preliminary study on the thermal and mechanical performances of sintered nano-scale silver die-attach technology depending on the substrate metallization. |
Abstract | ||
|---|---|---|
Silver sintering die-attach technology is one of the alternative solutions of die-attach technology which for the past 10 years appears as the most promising solution given the properties of silver and various works on the subject already realized. This study focuses on the thermal and mechanical performances evaluation of sintered nano-scale silver die-attach towards the substrate metallization. In a first approach, the thermal resistance evolution through thermal cycling (-40 degrees C/+125 degrees C) ageing and as well as the shear strength are focused on in order to provide some hints on the reliability of this technology. (C) 2012 Elsevier Ltd. All rights reserved. |
Year | DOI | Venue |
|---|---|---|
2012 | 10.1016/j.microrel.2012.06.121 | MICROELECTRONICS RELIABILITY |
Field | DocType | Volume |
Substrate (chemistry),Thermal,Nanoscopic scale,Shear strength,Sintering,Temperature cycling,Metallurgy,Engineering,Thermal resistance | Journal | 52 |
Issue | ISSN | Citations |
SP9-10 | 0026-2714 | 3 |
PageRank | References | Authors |
0.84 | 0 | 6 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| F. Le Henaff | 1 | 3 | 0.84 |
| Stephane Azzopardi | 2 | 6 | 2.68 |
| Jean-Yves Delétage | 3 | 15 | 5.68 |
| Eric Woirgard | 4 | 40 | 9.93 |
| S. Bontemps | 5 | 3 | 1.18 |
| J. Joguet | 6 | 3 | 0.84 |