Name
Year | DOI | Venue |
|---|---|---|
1996 | 10.1145/240518.240622 | DAC |
Keywords | Field | DocType |
cmos vlsi chip,complete chip-level thermal reliability,diagnosis tool,boundary condition,boundary conditions,integrated circuit packaging,temperature,vlsi,steady state,cmos integrated circuits,chip,packaging | Computer science,Workstation,Integrated circuit packaging,CMOS,Electronic engineering,Chip,Thermal boundary conditions,Transistor,Electronic circuit,Very-large-scale integration | Conference |
ISSN | ISBN | Citations |
0738-100X | 0-89791-779-0 | 6 |
PageRank | References | Authors |
1.97 | 3 | 5 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Yi-Kan Cheng | 1 | 121 | 26.99 |
| Chin-Chi Teng | 2 | 184 | 30.45 |
| Abhijit Dharchoudhury | 3 | 201 | 37.33 |
| Elyse Rosenbaum | 4 | 61 | 21.99 |
| Sung-Mo Steve Kang | 5 | 1198 | 213.14 |