Name
Title | ||
|---|---|---|
Pad Over Active (POA) solutions for three metal level BCD5 mixed power process - Design and validation of ESD protections |
Abstract | ||
|---|---|---|
Wire bonding pad schemes are designed to include ESD protections under their structure, in a three-metal mixed power process (BCD5). Several experiments, according to a defined qualification flow, have been performed to proof reliability and manufacturability of such solutions. No relevant failures have been put in evidence on a large sample size (similar to30k pads), demonstrating the feasibility of this option, which can have a significant impact on ICs' cost reduction: first products using Pad Over Active approach show a die size saving up to 10%. (C) 2003 Elsevier Ltd. All rights reserved. |
Year | DOI | Venue |
|---|---|---|
2003 | 10.1016/S0026-2714(03)00245-2 | Microelectronics Reliability |
Keywords | Field | DocType |
process design | Electronic engineering,Process design,Engineering | Journal |
Volume | Issue | ISSN |
43 | 9 | 0026-2714 |
Citations | PageRank | References |
0 | 0.34 | 0 |
Authors | ||
8 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| A. Andreini | 1 | 3 | 1.12 |
| C. Neva | 2 | 0 | 0.34 |
| L. Renard | 3 | 0 | 0.34 |
| G. Sironi | 4 | 0 | 0.34 |
| F. Speroni | 5 | 0 | 0.34 |
| L. Sponton | 6 | 1 | 1.50 |
| F. Tampellini | 7 | 0 | 0.34 |
| R. Tiziani | 8 | 0 | 1.01 |