Name
Title | ||
|---|---|---|
Evaluation by three-point-bend and ball-on-ring tests of thinning process on silicon die strength. |
Abstract | ||
|---|---|---|
With the onset of ultra-compact packages, systems in package may include stacked dies and mechanical sensors. Thus the thinning of silicon becomes necessary. The risk of failure, especially die crack, is often a major concern in the reliability of electronic packages. Therefore chip strength assessment becomes necessary for reliability prediction. In this paper, three-point-bend test and ball-on-ring test are compared to evaluate the risk of fracture of a silicon die as a function of its thickness, and of surface quality induced by the thinning process. Five thinning processes and six thicknesses (from 300 mu M down to 80 mu m) are statistically evaluated. (C) 2012 Elsevier Ltd. All rights reserved. |
Year | DOI | Venue |
|---|---|---|
2012 | 10.1016/j.microrel.2012.06.093 | MICROELECTRONICS RELIABILITY |
Field | DocType | Volume |
System in package,Thinning,Electronic packaging,Chip,Die (manufacturing),Engineering,Fissure,Die (integrated circuit),Silicon,Structural engineering | Journal | 52 |
Issue | ISSN | Citations |
SP9-10 | 0026-2714 | 2 |
PageRank | References | Authors |
0.53 | 1 | 4 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Samed Barnat | 1 | 2 | 0.87 |
| Hélène Frémont | 2 | 20 | 12.71 |
| Alexandrine Gracia | 3 | 3 | 0.92 |
| Eric Cadalen | 4 | 2 | 0.53 |