Title
Towards an inductively coupled power/data link for bondpad-less silicon chips
Abstract
This paper explores the concept of developing a bondpad-less fully-integrated inductive link for power/data transfer between a CMOS Integrated Circuit (IC) and a PCB. A key feature of the implemented system is that it requires no off-chip components. The proposed chip uses a standard 0.35 μm process and occupies an area of 2.5 mm × 2.5 mm and an on-chip inductor occupies an area of 1.5 mm × 1.5 mm. At 900 MHz, 9 mW was designed to be provided to the chip (up to 22.5 mW with a total efficiency of 5 %). Binary Phase Shift Keying (BPSK) and Load shift keying (LSK) are used for the the PCB-to-chip and chip-to-PCB link respectively for half-duplex communication. An Injection-Locked-Oscillator-based BPSK demodulator is implemented on-chip to save power. The maximum data rate for the PCB-to-chip link is lOMb/s. The estimated area of the circuitry is only 2 mm2 which is 32 % of the total chip area.
Year
DOI
Venue
2011
10.1109/ISCAS.2011.5938136
ISCAS
Keywords
Field
DocType
power/data transfer,cmos integrated circuits,injection locked oscillators,pcb-to-chip link,inductively coupled power/data link,on-chip inductor,lsk,power 9 mw,half-duplex communication,chip-to-pcb link,bit rate 10 mbit/s,cmos ic,size 0.35 mum,-less fully-integrated inductive link,bondpad-less silicon chips,silicon,printed circuits,phase shift keying,si,load shift keying,cmos integrated circuit,elemental semiconductors,injection-locked-oscillator-based bpsk demodulator,inductors,binary phase shift keying,frequency 900 mhz,couplings,demodulation,chip,system on a chip
Demodulation,System on a chip,Computer science,Inductor,CMOS,Chip,Electronic engineering,Integrated circuit,Electrical engineering,Data link,Phase-shift keying
Conference
ISSN
ISBN
Citations 
0271-4302 E-ISBN : 978-1-4244-9472-9
978-1-4244-9472-9
0
PageRank 
References 
Authors
0.34
1
4
Name
Order
Citations
PageRank
Song Luan1114.85
Amir Eftekhar2194.19
Olive H. Murphy300.34
Timothy G. Constandinou47838.42