Abstract | ||
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A resonant accelerometer with high sensitivity, fabricated through MEMS bulk-silicon processes, is proposed in this paper. The external acceleration can be transferred into the frequency shift of the resonant beams which is double-clamped by the proof mass and the anchor. To improve the sensitivity of the accelerometer, a micro leverage force amplifying mechanism is adopted, from which the transformation efficiency between the external acceleration and the axial stress of the resonant beam would be improved obviously. MEMS bulk-silicon processes were used on single one wafer to fabricate the sensor chip. The electromagnetic excitation and detection was used to make the closed-loop control of the sensor easier. Experimental results show that the Q-factor of the resonant beam is about 450 and the sensitivity of the accelerometer is about 1900Hz/g. © 2011 IEEE. |
Year | DOI | Venue |
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2011 | 10.1109/NEMS.2011.6017409 | NEMS |
Keywords | Field | DocType |
high q-factor,high sensitivity,mems,resonant accelerometer,chip,accelerometers,silicon,q factor,closed loop control | Wafer,Composite material,Q factor,Proof mass,Microelectromechanical systems,Accelerometer,Chip,Beam (structure),Acceleration,Acoustics,Materials science | Conference |
Volume | Issue | Citations |
null | null | 1 |
PageRank | References | Authors |
0.48 | 1 | 5 |
Name | Order | Citations | PageRank |
---|---|---|---|
Junbo Wang | 1 | 85 | 18.92 |
Yanlong Shang | 2 | 1 | 0.48 |
Sheng Tu | 3 | 1 | 0.48 |
Lei Liu | 4 | 171 | 17.10 |
Deyong Chen | 5 | 13 | 10.49 |