Name
Abstract | ||
|---|---|---|
Assembly technologies follow the reduction in size of circuit board components and correlatively the number of active layers increases significantly. Therefore, during a conventional acoustic analysis, the obtained image becomes more and more complicated to analyze. In a previous paper, we focused our research on a method for a suitable visualization of the timescale of an acoustic signal (CWT). In this paper we present the use of the non-destructive control for the study of a 3D package submitted to accelerated ageing tests using harsh conditions. |
Year | DOI | Venue |
|---|---|---|
2006 | 10.1016/j.microrel.2006.07.081 | Microelectronics Reliability |
Keywords | Field | DocType |
signal processing | Signal processing,Visualization,Electronic packaging,Printed circuit board,Electronic engineering,Accelerated aging,Miniaturization,Engineering,Electrical engineering | Journal |
Volume | Issue | ISSN |
46 | 9 | 0026-2714 |
Citations | PageRank | References |
1 | 0.61 | 2 |
Authors | ||
4 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Jean Augereau | 1 | 1 | 0.61 |
| Yves Ousten | 2 | 6 | 2.59 |
| B. Levrier | 3 | 3 | 1.21 |
| Laurent Bechou | 4 | 2 | 1.34 |