Name
Abstract | ||
|---|---|---|
Due to the continuously shrinking device structures and increasing densities of FPGAs, thermal aspects have become the new focus for many research projects over the last years. Most researchers rely on temperature simulations to evaluate their novel thermal management techniques. However, the accuracy of the simulations is to some extent questionable and they require a high computational effort if a detailed thermal model is used.For experimental evaluation of real-world temperature management methods, often synthetic heat sources are employed. Therefore, in this paper we investigated the question if we can create significant rises in temperature on modern FPGAs to enable future evaluation of thermal management techniques based on experiments in contrast to simulations. Therefore, we have developed eight different heat-generating cores that use different subsets of the FPGA resources. Our experimental results show that, according to the built-in thermal diode of our Xilinx Virtex-5 FPGA, we can increase the chip temperature by 134 degree C in less than 12 minutes by only utilizing about 21% of the slices. |
Year | DOI | Venue |
|---|---|---|
2012 | 10.1109/ReConFig.2012.6416745 | 2012 INTERNATIONAL CONFERENCE ON RECONFIGURABLE COMPUTING AND FPGAS (RECONFIG) |
Keywords | Field | DocType |
FPGA, temperature, heat, dedicated heat-generating core, measurement, oscillator | Thermal diode,Thermal model,Thermal,Computer science,Parallel computing,Thermal management of electronic devices and systems,Field-programmable gate array,Chip,Electronic engineering,Temperature measurement,Embedded system | Conference |
ISSN | Citations | PageRank |
2325-6532 | 6 | 0.53 |
References | Authors | |
12 | 4 | |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Markus Happe | 1 | 101 | 7.71 |
| Hendrik Hangmann | 2 | 10 | 1.00 |
| Andreas Agne | 3 | 78 | 7.28 |
| Christian Plessl | 4 | 297 | 35.98 |