Title
DFM in practice: hit or hype?
Abstract
DFM has taken shape by virtue of manufacturers defining a series of "DFM activities", related to parametric and stochastic yield analysis and recommendations for design changes to improve yield. The picture is made more complex because the view from integrated device manufacturers, pure play foundries, and fabless semiconductor companies is not necessarily the same as they have different needs and constrains. This panel brings together DFM practitioners from each of these communities to discuss real experiences on the adoption level achieved so far as well as the impact in the manufactured products. The panel should be of interest of designers moving to advanced nodes (to learn from the experience of those that have "done it already") as well as those in the leading edge (such that they can compare experiences).
Year
DOI
Venue
2008
10.1145/1391469.1391696
DAC
Keywords
Field
DocType
dfm activity,yield,leading edge,cmp,dfm practitioner,adoption level,advanced node,opc,lithography,design change,critical area analysis,integrated device manufacturer,fabless semiconductor company,dfm,different need,stochastic yield analysis,design for manufacture,production,layout,graphics,shape,robustness
Critical area analysis,Graphics,Computer science,Manufacturing engineering,Electronic engineering,Design for manufacturability
Conference
Citations 
PageRank 
References 
1
0.58
1
Authors
8
Name
Order
Citations
PageRank
Juan C. Rey131.62
NS Nagaraj231.05
Andrew B. Kahng37582859.06
Fabian Klass4779.56
Rob Aitken510.92
Cliff Hou671.92
Luigi Capodieci7213.69
Vivek Singh810.58