Name
Title | ||
|---|---|---|
Interconnect Thermal Modeling For Accurate Simulation Of Circuit Timing And Reliability |
Abstract | ||
|---|---|---|
We apply three-dimensional finite element analysis to study the thermal coupling between nearby interconnects. We find that the temperature rise in current-carrying lines is significantly influenced by a dense array of lines in a nearby metal level. In contrast, thermal coupling between just two neighboring parallel lines is insignificant for most geometries. Design rules for average root-mean-square current density are provided for specific geometries given the requirement that the interconnect temperature be no more than 5 degrees C above the substrate temperature, Semi-empirical formulae for coupling effects are presented based on the numerical results. A procedure is proposed to implement the formulae in computer-aided design tools. |
Year | DOI | Venue |
|---|---|---|
2000 | 10.1109/43.828548 | IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS |
Keywords | DocType | Volume |
interconnect, self-heating, thermal resistance | Journal | 19 |
Issue | ISSN | Citations |
2 | 0278-0070 | 12 |
PageRank | References | Authors |
3.62 | 2 | 4 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Danqing Chen | 1 | 14 | 5.52 |
| Erhong Li | 2 | 14 | 5.52 |
| Elyse Rosenbaum | 3 | 61 | 21.99 |
| Sung-Mo Steve Kang | 4 | 1198 | 213.14 |