Title
Two Approaches for the Design of Molded Interconnect Devices (3D-MID).
Abstract
To meet the challenges of designing mechatronic products, a program called MIDCAD was implemented which combines the functionality of Electronic Computer Aided Design (ECAD) and Mechanic CAD (MCAD) systems. Especially three-dimensional Molded Interconnect Devices (MID) and the layout of the electrical circuitry on their spatial surfaces are supported. In addition to MIDCAD there is a new research project working out the integration of macro-MID technology in automobiles (IMTP). On the one hand, the MCAD system CATIA V5 was enhanced by a computation of electrical properties of electric circuits and an automatic generation of the 3D electric conductor layout. The second part accomplishes the preparation of product information in CAD for automated production processes (CAM). This CAD-CAM-chain for a new technology called Flamecon (R) was developed in cooperation with LEONI AG, Germany. Furthermore, a technology database for MIDs was integrated plus a universal data format for geometry and extended information was implemented.
Year
DOI
Venue
2009
10.1007/978-3-642-10430-5_6
PROCEEDINGS OF THE 6TH CIRP-SPONSORED INTERNATIONAL CONFERENCE ON DIGITAL ENTERPRISE TECHNOLOGY
Keywords
Field
DocType
Computer-Aided Design (CAD),Molded Interconnect Device (3D-MID),Computer-Aided Manufacturing (CAM)
CAD,Data format,Engineering drawing,Computer science,Computer Aided Design,Electrical conductor,Interconnection,Electronic circuit,Mechatronics,Computation
Conference
Volume
ISSN
Citations 
66
1867-5662
1
PageRank 
References 
Authors
0.39
0
3
Name
Order
Citations
PageRank
Christian Fischer110.39
Jörg Franke22620.00
Klaus Feldmann310.39