Abstract | ||
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This paper details the design and implementation of an asynchronous 3D-NoC router using a novel serialization scheme in the vertical directions which targets 3D production oriented processes. A study of the router cost has been conducted for medium and high density TSVs on 65nm and 32nm nodes. A router integrating the serial link has been implemented in 65nm using medium density TSVs. The serial link provides a throughput of 16 Gb/s for an area gain of 57%, and an additional cost of one NoC routing hop in latency and in energy. |
Year | DOI | Venue |
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2011 | 10.1109/ISVLSI.2011.59 | ISVLSI |
Keywords | Field | DocType |
high density tsvs,noc routing hop,paper detail,serial vertical links,additional cost,novel serialization scheme,router cost,physical implementation,vertical direction,medium density tsvs,serial link,area gain,network routing,synchronization,asynchronous circuit,multiplexing,throughput,network on chip,serialization | Serial communication,Asynchronous communication,Computer science,Bridge router,Computer network,Network on a chip,Core router,Router,Throughput,One-armed router | Conference |
ISSN | ISBN | Citations |
2159-3469 E-ISBN : 978-0-7695-4447-2 | 978-0-7695-4447-2 | 20 |
PageRank | References | Authors |
0.93 | 12 | 4 |
Name | Order | Citations | PageRank |
---|---|---|---|
Florian Darve | 1 | 32 | 2.18 |
Abbas Sheibanyrad | 2 | 115 | 6.43 |
Pascal Vivet | 3 | 606 | 53.09 |
Frédéric Petrot | 4 | 151 | 14.80 |