Title
Resolution improvement of acoustic microimaging by continuous wavelet transform for semiconductor inspection
Abstract
Acoustic microimaging (AMI) is used as an important non-destructive tool in semiconductor reliability evaluation and failure analysis. As advanced microelectronic packages are being produced smaller and thinner, detection of the internal features and defects in the packages is approaching the resolution limits for conventional AMI. To meet this challenge, an acoustic time–frequency domain imaging technique is proposed in this paper, which utilizes the excellent time–frequency localization characteristics of the continuous wavelet transform (CWT) to improve the axial resolution of AMI, without increasing acoustic frequencies.
Year
DOI
Venue
2006
10.1016/j.microrel.2005.07.008
Microelectronics Reliability
Keywords
Field
DocType
frequency domain,time frequency,failure analysis,continuous wavelet transform,time domain
Frequency domain,Time domain,Microelectronics,Electronic packaging,Continuous wavelet transform,Electronic engineering,Robustness (computer science),Engineering,Semiconductor,Computation
Journal
Volume
Issue
ISSN
46
5
0026-2714
Citations 
PageRank 
References 
1
0.39
3
Authors
3
Name
Order
Citations
PageRank
Guang-Ming Zhang152.00
David M. Harvey262.50
Derek R. Braden340.92