Name
Abstract | ||
|---|---|---|
•Polyimide Isotropic Conductive Adhesive for passive components assemblies.•Thermo-mechanical behaviour in harsh thermal environment.•Shear tests were carried out for thermo-mechanical characterization.•Numerical modelling simulations have shown the most probable failure area.•The most critical parameters for extreme temperature applications are defined. |
Year | DOI | Venue |
|---|---|---|
2013 | 10.1016/j.microrel.2013.07.040 | Microelectronics Reliability |
Field | DocType | Volume |
Isotropy,Composite material,Shear (sheet metal),Electrical conductor,Finite element method,Electronic engineering,Adhesive,Polyimide,Ultimate tensile strength,Engineering,Void (astronomy),Forensic engineering | Journal | 53 |
Issue | ISSN | Citations |
9 | 0026-2714 | 2 |
PageRank | References | Authors |
0.47 | 0 | 3 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| J. B. Jullien | 1 | 2 | 0.81 |
| Hélène Frémont | 2 | 20 | 12.71 |
| Jean-Yves Delétage | 3 | 15 | 5.68 |