Paper Info
Title
Spatially distributed 3D circuit models
Abstract
Spatially distributed 3D circuit models are extracted with a segment-to-segment BEM (Boundary Element Method) algorithm for both capacitance and inverse inductance couplings rather than using the traditional net-to-net approach. Critical issues regarding the extraction efficiency and accuracy of segment-to-segment BEM capacitance models are explored. An adaptive discretization scheme is developed for segment-to-segment capacitance extraction and also applied to segment-to-segment high-frequency inverse inductance extraction. We demonstrate the limitations of the duality between capacitance and inverse inductance. Examples demonstrating the accuracy of these models are presented for real packaging cases.
Year
DOI
Venue
2005
10.1145/1065579.1065621
Design Automation Conference
Keywords
Field
DocType
segment-to-segment bem capacitance model,segment-to-segment bem,circuit model,inverse inductance,segment-to-segment capacitance extraction,critical issue,boundary element method,extraction efficiency,adaptive discretization scheme,high-frequency inverse inductance extraction,inductance,sparse matrices,capacitance,electrostatics,inverse problems,design automation,shape,data mining,high frequency,integrated circuit packaging,magnetostatics
Inverse,Discretization,Inductance,Capacitance,Computer science,Integrated circuit packaging,Electronic engineering,Inverse problem,Boundary element method,Sparse matrix
Conference
ISSN
ISBN
Citations 
0738-100X
1-59593-058-2
0
PageRank 
References 
Authors
0.34
11
4
Name
Order
Citations
PageRank
Michael W. Beattie1648.66
Hui Zheng2505.19
Anirudh Devgan3107092.77
Byron Krauter46810.21