Name
Abstract | ||
|---|---|---|
Delaminations are a major concern in plastic encapsulated devices (PED). This paper presents three complementary methods to evaluate the sensitivity of PED to this problem. Analytical models are fast to implement, and permit to derive a comparative evaluation between different packages. To refine the results, finite element models, necessitating longer calculation times are very useful, but need to be validated by real measurements, which can be done with assembly test chips. (C) 2004 Published by Elsevier Ltd. |
Year | DOI | Venue |
|---|---|---|
2004 | 10.1016/j.microrel.2004.07.015 | MICROELECTRONICS RELIABILITY |
Field | DocType | Volume |
Electronic packaging,Finite element method,Engineering,Numerical analysis,Reliability engineering,Delamination | Journal | 44 |
Issue | ISSN | Citations |
9-11 | 0026-2714 | 1 |
PageRank | References | Authors |
0.39 | 0 | 4 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Hélène Frémont | 1 | 20 | 12.71 |
| Jean-Yves Delétage | 2 | 1 | 0.39 |
| Kirsten Weide-Zaage | 3 | 31 | 14.97 |
| Yves Danto | 4 | 10 | 4.75 |