Title
Overcoming chip-to-chip delays and clock skews
Abstract
In general, mapping a circuit onto several chips incurs a physical setting which differs from those within a chip. Specifically, the delay of chip-to-chip interconnections is much longer than on-chip delays of wires and gates. This delay effects the bandwidth as well. In addition, the clock skew between chips is larger than the clock skew within a chip. One may mistakenly conclude that the feasible clock period of a systolic array cannot be smaller than the maximal delay of an interconnection in a realization of the circuit. This paper proposes a technique for mapping large systolic linear arrays and systolic two-dimensional arrays onto several chips while almost maintaining the clock rates which are obtainable when these circuits are small enough to fit into a single chip. Our solution does not rely on special analogue techniques. It is described in a sequence of transformations (logic duplication and retiming), reductions, and an implementation of interconnections which have a required behavior in a given physical setting. It is shown that each step preserves functionality, and subsequently, the correctness of the proposed solution is implied.
Year
DOI
Venue
1996
10.1016/S0167-9260(97)00028-X
Integration
Keywords
DocType
Volume
physical setting,large systolic linear array,feasible clock period,clock skews,systolic array,delay effect,chip-to-chip delays,clock skew,single chip,clock rate,maximal delay,on-chip delay,chip-to-chip delay,retiming,ambient intelligence,logic design,chip,logic,computer science,very large scale integration,bandwidth
Conference
24
Issue
ISSN
ISBN
2
Integration, the VLSI Journal
0-8186-7542-X
Citations 
PageRank 
References 
1
0.40
5
Authors
2
Name
Order
Citations
PageRank
Guy Even11194136.90
Ami Litman224049.78