Name
Title | ||
|---|---|---|
Fabrication of complicated three dimensional structures utilizing multi-stack bonding |
Abstract | ||
|---|---|---|
Hybrid multi-wafer bonding that combines both anodic bonding and silicon direct bonding is one of the most promising manufacturing techniques for creating complex three-dimensional (3D) structures. However, the results of some key micro-fabrication processes will significantly influence the performance of 3D multilayered devices. These problems include: (1) electrical conduction property across the interface of hydrophilic direct bonded wafers; (2) the fabrication of silicon wire. Some key techniques are developed to solve these problems. These solutions are also applicable to fabricate other Microelectromechanical System devices with complex 3D structures. |
Year | DOI | Venue |
|---|---|---|
2009 | 10.1109/NEMS.2009.5068767 | NEMS |
Keywords | Field | DocType |
promising manufacturing technique,multi-stack bonding,3d structure,hybrid multi-wafer bonding,silicon direct bonding,3d multilayered devices,multi stack bonding,dimensional structure,complicated three dimensional structures,anodic bonding,key micro-fabrication process,microelectromechanical system device,silicon wire,multi-wafer bonding,key technique,semiconductor device manufacture,microfabrication,multilayered device,wafer bonding,microfabrication processes,multilayers,electrical conduction property,silicon,etching,resistance,electric conductivity,atomic layer deposition,three dimensional,fabrication | Wafer,Nanotechnology,Wire bonding,Wafer bonding,Anodic bonding,Direct bonding,Materials science,Silicon,Fabrication,Microfabrication | Conference |
ISSN | ISBN | Citations |
2474-3747 | 978-1-4244-4630-8 | 0 |
PageRank | References | Authors |
0.34 | 0 | 5 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Mingda Zhou | 1 | 10 | 1.65 |
| Yilong Hao | 2 | 12 | 4.49 |
| Chengchen Gao | 3 | 11 | 3.74 |
| Zhihong Li | 4 | 62 | 27.17 |
| Qifang Hu | 5 | 0 | 1.01 |