Title
Hierarchical electromigration reliability diagnosis for VLSI interconnects
Abstract
In this paper, we present a hierarchical reliability-driven CAD system for the design of electromigration resistant circuits. The top of the hierarchy aims at quickly identifying those critical interconnects with potential electromigration reliability problems. Then the detailed electromigration analysis of critical interconnects is carried out by an accurate and computationally efficient simulation tool (ITEM). This top-down approach provides a feasible solution to the complicated electromigration diagnosis problem
Year
DOI
Venue
1996
10.1109/DAC.1996.545673
DAC
Keywords
Field
DocType
electromigration,vlsi interconnects,electromigration resistant circuits,computationally efficient simulation tool,potential electromigration reliability problems,top-down approach,hierarchical electromigration reliability diagnosis,complicated electromigration diagnosis problem,hierarchical reliability-driven cad system,top down approach,top down,very large scale integration,stress,computational modeling,current density,design automation
Permission,Computer science,Electronic engineering,Electronic design automation,Cad system,Electronic circuit,Electromigration,Very-large-scale integration,Reliability engineering
Conference
ISSN
ISBN
Citations 
0738-100X
0-7803-3294-6
2
PageRank 
References 
Authors
0.45
8
4
Name
Order
Citations
PageRank
Chin-Chi Teng118430.45
Yi-Kan Cheng212126.99
Elyse Rosenbaum36121.99
Sung-Mo Steve Kang41198213.14