Abstract | ||
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In this paper, we present a hierarchical reliability-driven CAD system for the design of electromigration resistant circuits. The top of the hierarchy aims at quickly identifying those critical interconnects with potential electromigration reliability problems. Then the detailed electromigration analysis of critical interconnects is carried out by an accurate and computationally efficient simulation tool (ITEM). This top-down approach provides a feasible solution to the complicated electromigration diagnosis problem |
Year | DOI | Venue |
---|---|---|
1996 | 10.1109/DAC.1996.545673 | DAC |
Keywords | Field | DocType |
electromigration,vlsi interconnects,electromigration resistant circuits,computationally efficient simulation tool,potential electromigration reliability problems,top-down approach,hierarchical electromigration reliability diagnosis,complicated electromigration diagnosis problem,hierarchical reliability-driven cad system,top down approach,top down,very large scale integration,stress,computational modeling,current density,design automation | Permission,Computer science,Electronic engineering,Electronic design automation,Cad system,Electronic circuit,Electromigration,Very-large-scale integration,Reliability engineering | Conference |
ISSN | ISBN | Citations |
0738-100X | 0-7803-3294-6 | 2 |
PageRank | References | Authors |
0.45 | 8 | 4 |
Name | Order | Citations | PageRank |
---|---|---|---|
Chin-Chi Teng | 1 | 184 | 30.45 |
Yi-Kan Cheng | 2 | 121 | 26.99 |
Elyse Rosenbaum | 3 | 61 | 21.99 |
Sung-Mo Steve Kang | 4 | 1198 | 213.14 |