Title
Fabrication of Multi-Scale Triangular Patch High Impedance Ground Planes to Improve the Bandwidth of Conformal Bow-Tie Antennas for Remote Sensing
Abstract
The realization and performance is demonstrated of a conformal bow-tie antenna printed on a multi-scale triangular element mushroom structure high-impedance ground-plane (HIGP). The two-scale HIGP was designed to exhibit a large frequency band-gap to cover the relatively broad operational frequency bandwidth of the bow-tie antenna. HIGP elements were chosen to be triangular to form a natural commensurate blending of the bow-tie into the structure. The experimental performance is characterized of the bow-tie-HIGP combination from 2-10 GHz, and it is demonstrated that the negative effects of a perfect electric conductor ground-plane may be mitigated by using a HIGP.
Year
DOI
Venue
2008
10.1109/IGARSS.2008.4779996
Geoscience and Remote Sensing Symposium, 2008. IGARSS 2008. IEEE International
Keywords
Field
DocType
antenna earths,antenna theory,geophysical equipment,remote sensing,antenna operational frequency bandwidth,conformal bow tie antenna bandwidth,frequency 2 GHz to 10 GHz,frequency band gap,high impedance ground planes,multiscale triangular element mushroom structure,multiscale triangular patch HIGP,perfect conductor effects,remote sensing antennas,Antennas,High Impedance Ground Planes
Antenna (radio),Dipole antenna,Computer science,Remote sensing,Optics,Electrical impedance,Conformal map,Bandwidth (signal processing),Bow tie,Perfect conductor,High impedance
Conference
Volume
ISBN
Citations 
4
978-1-4244-2808-3
0
PageRank 
References 
Authors
0.34
0
5
Name
Order
Citations
PageRank
Bora Cakiroglu100.34
P. J. Collins2197.65
Michael J. Havrilla342.24
Kubilay Sertel432.69
A. J. Terzuoli52613.90