Name
Abstract | ||
|---|---|---|
For mobile electronic devices the trend of market leads to a rising number of features while the dimension of the electronic devices keeps constant or even shrinks. On transistor level the miniaturization reaches its limits and more ICs will be required. More in and out contacts of the ICs have to be realized and the increasing contact density leads to rising current densities, due to smaller solder joints. Similar to the reliability problems with interconnects on IC level, the rising current densities lead to migration induced void formation in the solder joints. In consequence migration induced phenomena have a growing influence on the lifetime of the packages. Hence it is necessary to investigate the migration induced material transport in solder joints to enable a prediction of the package lifetime. |
Year | DOI | Venue |
|---|---|---|
2012 | 10.1016/j.microrel.2012.06.115 | Microelectronics Reliability |
Field | DocType | Volume |
Flip chip,Electronic engineering,Soldering,Current crowding,Miniaturization,Engineering,Joule heating,Electromigration,Void (astronomy),Package on package | Journal | 52 |
Issue | ISSN | Citations |
12 | 0026-2714 | 1 |
PageRank | References | Authors |
0.45 | 1 | 3 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Lutz Meinshausen | 1 | 8 | 3.47 |
| Kirsten Weide-Zaage | 2 | 31 | 14.97 |
| Hélène Frémont | 3 | 20 | 12.71 |