Title
Development of embedded capacitor with bismuth-based pyrochlore thin films at low temperatures for printed circuit board applications
Abstract
Bi2Mg2/3Nb4/3O7 (BMN) pyrochlore films deposited on Cu/Si substrates at low temperatures are characterized for structural and dielectric properties as a function of oxygen flow rate. BMN films deposited at 150°C were partially crystallized with nano-sized crystallines of approximately 8.7nm. The dielectric properties of films are independent on variation of an oxygen flow rate, but the lowest leakage current densities observed in the range between 10 and 30sccm(standard cc/min). BMN films (50nm-thick) deposited at 100°C and an oxygen flow rate of 30sccm show a capacitance density of 570nF/cm2 and a breakdown voltage of 3V.
Year
DOI
Venue
2007
10.1016/j.microrel.2007.01.038
Microelectronics Reliability
Keywords
Field
DocType
breakdown voltage,leakage current,printed circuit board,flow rate,thin film,dielectric properties
Pyrochlore,Current density,Capacitance,Leakage (electronics),Dielectric,Electronic engineering,Breakdown voltage,Thin film,Engineering,Bismuth
Journal
Volume
Issue
ISSN
47
4
0026-2714
Citations 
PageRank 
References 
0
0.34
0
Authors
13