Name
Abstract | ||
|---|---|---|
This special session on 3D TSV's will highlight some of the fabrication processes and used technologies to create vias from the frontside of an active circuit to its backside and potential implementation solutions to form complex systems leveraging these novel possibilities. General techniques for via formation are discussed as well as advanced integration solutions leveraging the power of 3D TSV's. |
Year | DOI | Venue |
|---|---|---|
2008 | 10.1109/DTIP.2008.4752965 | DTIP 2008: SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS |
Keywords | DocType | Volume |
complex systems,si,packaging,silicon,etching | Journal | abs/0805.0 |
ISSN | Citations | PageRank |
Dans Symposium on Design, Test, Integration and Packaging of
MEMS/MOEMS - DTIP 2008, Nice : France (2008) | 0 | 0.34 |
References | Authors | |
0 | 6 | |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Erik Jung | 1 | 0 | 1.01 |
| Andreas Ostmann | 2 | 5 | 2.42 |
| peter ramm | 3 | 23 | 5.39 |
| Jürgen Wolf | 4 | 0 | 0.34 |
| Michael Toepper | 5 | 140 | 8.55 |
| Maik Wiemer | 6 | 0 | 0.34 |