Paper Info
Title
Characterization of elasto-plastic behavior of actual SAC solder joints for drop test modeling
Abstract
This paper focuses on the characterization of the elasto-plastic properties of actual Sn–1.0wt.%Ag–0.5wt.%Cu (SAC105), Sn–3.0wt.%Ag–0.5wt.%Cu (SAC305) and Sn–4.0wt.%Ag–0.5wt.%Cu (SAC405) solder joints for drop test modeling. Several actual ChipArray® BGA (CABGA) packages were cross-sectioned, polished and used as the test vehicles. The drop tests were performed with various impact amplitudes using a specially designed mini drop table along with a conventional drop table to generate plastic deformations in the solder joints. The plastic deformations in the solder joints were measured after each drop using microscope imaging in conjunction with the digital image correlation (DIC) technique. The coefficients of the Ramberg–Osgood elasto-plastic model for the solder alloys were extracted from the experimental results using a finite element method (FEM) modeling-based iteration process. An application and validation of the developed model were carried out using pendulum tests.
Year
DOI
Venue
2011
10.1016/j.microrel.2011.03.019
Microelectronics Reliability
Keywords
Field
DocType
plastic deformation,cross section,finite element method,digital image correlation
Ball grid array,Polishing,Drop test,Electronic packaging,Finite element method,Soldering,Digital image correlation,Deformation (engineering),Engineering,Structural engineering
Journal
Volume
Issue
ISSN
51
8
0026-2714
Citations 
PageRank 
References 
3
0.59
4
Authors
2
Name
Order
Citations
PageRank
Tung T Nguyen1578.29
Seung-Bae Park2648.99