Paper Info
Title
Analytical signal integrity verification models for inductance-dominant multi-coupled VLSI interconnects
Abstract
Novel signal integrity verification models for inductance-dominant RLC interconnect lines are developed by using a traveling-wave-based waveform approximation (TWA) technique. The multi-coupled line responses are decoupled into the eigenmodes of the system in order to exploit the TWA technique. Then, the response signals are mathematically represented by the linear combination of each eigenmode response based on TWA, followed by reporting the signal integrity models for the multi-coupled lines. The signal integrity of VLSI circuit interconnects has a strong correlation with input signal switching-patterns in the multiple lines. With the proposed analytic signal integrity models, the switching-dependent signal delay, crosstalk, ringing, and glitches of the inductance-dominant RLC interconnect lines can be accurately as well as efficiently determined. It is shown that the models have excellent agreement with SPICE simulations.
Year
DOI
Venue
2002
10.1145/505348.505361
SLIP
Keywords
Field
DocType
analytical signal integrity verification,multi-coupled line,eigenmode response,vlsi interconnects,signal integrity model,response signal,switching-dependent signal delay,novel signal integrity verification,twa technique,signal integrity,proposed analytic signal integrity,input signal switching-patterns,glitch,transmission line,analytic signal,crosstalk,traveling wave,ringing
Analytic signal,Inductance,Transmission line,Ringing,Computer science,Signal integrity,Waveform,Electronic engineering,RLC circuit,Very-large-scale integration
Conference
ISBN
Citations 
PageRank 
1-58113-481-9
3
0.41
References 
Authors
7
4
Name
Order
Citations
PageRank
Seongkyun Shin1293.15
Yungseon Eo2628.67
William R. Eisenstadt36511.80
Jongin Shim4514.57