Title
Yield improvement via minimisation of step height non-uniformity in chemical mechanical planarisation (CMP) with pressure and velocity as control variables
Year
DOI
Venue
2005
10.1504/IJMTM.2005.007698
IJMTM
Keywords
Field
DocType
silicon wafers,wafer fabrication,semiconductor manufacturing
Flatness (systems theory),Planarity testing,Dielectric,Semiconductor device fabrication,Pressure control,Minimisation (psychology),Control variable,Engineering,Operations management,Chemical-mechanical planarization
Journal
Volume
Issue
Citations 
7
5/6
0
PageRank 
References 
Authors
0.34
0
4
Name
Order
Citations
PageRank
Muthukkumar S. Kadavasal1122.21
Abhijit Chandra2123.72
Sutee Eamkajornsiri300.34
Ashraf-F. Bastawros400.68