Name
Abstract | ||
|---|---|---|
Carbon nanotubes and graphene nanoribbons are two promising next-generation interconnect technologies. Electrical modeling and performance analysis have demonstrated the superiority of these emerging technologies compared to conventional copper interconnects, as this article explains. |
Year | DOI | Venue |
|---|---|---|
2010 | 10.1109/MDT.2010.55 | IEEE Design & Test of Computers |
Keywords | Field | DocType |
electrical performance analysis,next-generation ics,delay,graphene nanoribbons,microprocessor chips,carbon nanomaterials,integrated circuits,electrical interconnects,next-generation ic,graphene nanoribbon (gnr),technology interconnection,carbon nanotube (cnt),carbon nanotubes,copper interconnection,through-silicon vias (tsvs),performance evaluation,sriram vangal,power,performance analysis,design and test,electrical modeling,conventional copper interconnects,optical interconnects,on-chip vias,ideal interconnect technology,rf or wireless interconnects,chip,temperature,conductivity,optical scattering,shape,through silicon via,carbon nanotube,nanomaterials,lattices,emerging technology,copper | Computer science,Electronic engineering,Graphene nanoribbons,Emerging technologies,Carbon nanotube,Interconnection,Interconnect technology,Integrated circuit,Carbon,Nanomaterials | Journal |
Volume | Issue | ISSN |
27 | 4 | 0740-7475 |
Citations | PageRank | References |
9 | 1.22 | 1 |
Authors | ||
3 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Hong Li | 1 | 36 | 3.02 |
| Chuan Xu | 2 | 140 | 22.01 |
| Kaustav Banerjee | 3 | 828 | 107.56 |