Title
Maximizing handler thermal throughput with a rib-roughened test tray
Abstract
A new design feature of an integrated circuit (IC) testhandler tray is described that significantly improves theconvective heat transfer to the tray and the IC devices inthe tray. The improved tray incorporates verticallyprotruding ribs which breakup thermal boundary layersand enhance mixing. High-speed, tray-based handlers canconsequently warm or cool trays of devices at substantiallyfaster rates. Design equations for the tray ribs are verifiedthrough experimental testing and provide a means topredict the warm-up or cool-down times of the tray anddevices.
Year
DOI
Venue
1998
10.1109/TEST.1998.743143
ITC
Keywords
Field
DocType
design equation,rib-roughened test tray,tray rib,inthe tray,cool tray,improved tray,handler thermal throughput,tray anddevices,new design feature,ic device,testhandler tray,breakup thermal boundary,throughput,mixing,wind tunnel,pipe flow,ducts,ribs,thermal boundary layer,convective heat transfer,thermal conductivity,heat transfer,turbulence,integrated circuit
Thermal,Experimental testing,Computer science,Heat transfer,Electronic engineering,Convective heat transfer,Throughput,Tray,Pipe flow,Integrated circuit
Conference
ISSN
ISBN
Citations 
1089-3539
0-7803-5093-6
0
PageRank 
References 
Authors
0.34
0
3
Name
Order
Citations
PageRank
Andreas C. Pfahnl110.73
John H. Lienhard V2123.90
Alexander H. Slocum3297.02