Name
Abstract | ||
|---|---|---|
The system-on-a-package (SOP) concept is considered as the solution of future communication modules, where more functionality, better performance, low cost, and more integrity is needed. We demonstrate how SOP technology can address the integration platform for future communication systems, especially gigabit wireless communications. After the introduction of the SOP concept, we introduce the crit... |
Year | DOI | Venue |
|---|---|---|
2004 | 10.1109/JPROC.2003.821902 | Proceedings of the IEEE |
Keywords | Field | DocType |
Low pass filters,Impedance matching,Integrated circuit technology,Cost function,Wireless communication,Radio frequency,Inductors,Capacitors,Resistors,Collaboration | Signal processing,Gigabit,Antenna diversity,Computer architecture,Wireless,Balun,Communications system,Electronic engineering,Engineering,Integration platform,Integrated circuit | Journal |
Volume | Issue | ISSN |
92 | 2 | 0018-9219 |
Citations | PageRank | References |
1 | 0.63 | 0 |
Authors | ||
2 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| R. R. Tummala | 1 | 6 | 3.36 |
| J. Laskar | 2 | 27 | 6.51 |