Title
Bond graph based sensitivity and uncertainty analysis modelling for micro-scale multiphysics robust engineering design
Abstract
Components within micro-scale engineering systems are often at the limits of commercial miniaturization and this can cause unexpected behavior and variation in performance. As such, modelling and analysis of system robustness plays an important role in product development. Here, schematic bond graphs are used as a front end in a sensitivity analysis based strategy for modelling robustness in multi-physics micro-scale engineering systems. As an example, the analysis is applied to a behind-the-ear (BTE) hearing aid.
Year
DOI
Venue
2008
10.1016/j.jfranklin.2007.10.002
Journal of the Franklin Institute
Keywords
Field
DocType
Bond graph modelling,Sensitivity analysis,Uncertainty analysis,Hearing aid device,Multiphysics,Robustness
Mathematical optimization,Multiphysics,Simulation,Schematic,Robustness (computer science),Uncertainty analysis,Control engineering,Engineering design process,System dynamics,Bond graph,System identification,Mathematics
Journal
Volume
Issue
ISSN
345
3
0016-0032
Citations 
PageRank 
References 
0
0.34
4
Authors
4
Name
Order
Citations
PageRank
M.A. Perry100.34
Mark Atherton221.13
R.A. Bates300.34
H.P. Wynn400.34