Title | ||
---|---|---|
Bond graph based sensitivity and uncertainty analysis modelling for micro-scale multiphysics robust engineering design |
Abstract | ||
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Components within micro-scale engineering systems are often at the limits of commercial miniaturization and this can cause unexpected behavior and variation in performance. As such, modelling and analysis of system robustness plays an important role in product development. Here, schematic bond graphs are used as a front end in a sensitivity analysis based strategy for modelling robustness in multi-physics micro-scale engineering systems. As an example, the analysis is applied to a behind-the-ear (BTE) hearing aid. |
Year | DOI | Venue |
---|---|---|
2008 | 10.1016/j.jfranklin.2007.10.002 | Journal of the Franklin Institute |
Keywords | Field | DocType |
Bond graph modelling,Sensitivity analysis,Uncertainty analysis,Hearing aid device,Multiphysics,Robustness | Mathematical optimization,Multiphysics,Simulation,Schematic,Robustness (computer science),Uncertainty analysis,Control engineering,Engineering design process,System dynamics,Bond graph,System identification,Mathematics | Journal |
Volume | Issue | ISSN |
345 | 3 | 0016-0032 |
Citations | PageRank | References |
0 | 0.34 | 4 |
Authors | ||
4 |
Name | Order | Citations | PageRank |
---|---|---|---|
M.A. Perry | 1 | 0 | 0.34 |
Mark Atherton | 2 | 2 | 1.13 |
R.A. Bates | 3 | 0 | 0.34 |
H.P. Wynn | 4 | 0 | 0.34 |