Title
Nbti Reliability Of Pfets Under Post-Fabrication Self-Improvement Scheme For Sram
Abstract
In this paper, negative bias temperature instability (NBTI) reliability of pFETs is analyzed under the post-fabrication SRAM self-improvement scheme that we have developed recently, where cell stability is self-improved by simply applying high stress voltage to supply voltage terminal (V-DD) of SRAM cells. It is newly found that there is no significant difference in both threshold voltage and drain current degradation by NBTI stress between fresh PFETs and PFETs after self-improvement scheme application, indicating that the self-improvement scheme has no critical reliability problem.
Year
DOI
Venue
2013
10.1587/transele.E96.C.620
IEICE TRANSACTIONS ON ELECTRONICS
Keywords
Field
DocType
Negative Bias Temperature Instability (NBTI), variability, SRAM, transistor, MOSFET
Self improvement,Electronic engineering,Static random-access memory,Engineering,Transistor,MOSFET,Fabrication
Journal
Volume
Issue
ISSN
E96C
5
1745-1353
Citations 
PageRank 
References 
1
0.48
3
Authors
5
Name
Order
Citations
PageRank
Nurul Ezaila Alias110.82
Anil Kumar211.16
Takuya Saraya312.17
Shinji Miyano48512.63
Toshiro Hiramoto5278.14