Paper Info
Title
Modeling study of thermosonic flip chip bonding process.
Abstract
Thermosonic flip chip (TSFC) bonding is a developing area-array microelectronic package technology. To better understand the bonding formation mechanism, a dynamic finite element model of the TSFC bonding process was developed, where the soften effect caused by the heat stage and ultrasonic vibration was considered in the constitutive relation of the gold bump. With this model, the strain evolution processes for the bump and the bump/pad interface were obtained and compared, and it was found that the deformation of the bump is always larger than that of the bonding interface; this may decrease the Allowable I/O pitch and bonding strength. To increase the ratio of the strain of the bonding interface to that of the bump, parameter studies are carried out, and the effects of ultrasonic vibration amplitude, bonding force, and static friction coefficient on the plastic deformation and strain distribution on the bump and the bump/pad contact interface were studied. Based on the simulation results, the effects of the parameters on the strain distribution were obtained, and some recommendations for parameter optimization are given. This FE simulation study may assist in process window development for fine pitch TSFC bonding.
Year
DOI
Venue
2012
10.1016/j.microrel.2012.03.029
Microelectronics Reliability
Field
DocType
Volume
Flip chip,Composite material,Microelectronics,Electronic engineering,Finite element method,Thermosonic bonding,Deformation (mechanics),Engineering,Deformation (engineering),Numerical analysis,Structural engineering,Constitutive equation
Journal
52
Issue
ISSN
Citations 
11
0026-2714
0
PageRank 
References 
Authors
0.34
2
2
Name
Order
Citations
PageRank
Fuliang Wang112.06
Yun Chen242.43